As usual, Qualcomm‘s next-generation flagship platform Snapdragon 875 will be unveiled in the fourth quarter of this year but we’ll have o wait until Q1 2021 to find it inside a commercially available smartphone. Details have now emerged about the next-gen mobile platform. Tipster Roland Quandt has revealed that the Snapdragon 875 (SM8350)adopts the internal codename Lahaina. The name is originally that of a city in Maui, one of the seven Hawaiian Islands.
A previous leak tips the next-generation Qualcomm chipset to adopt the name Snapdragon 875G instead of Snapdragon 875. However, Qualcomm is yet to confirm the name yet so we’ll stick with SD875.
Pretty sure Qualcomm Snapdragon 875 (SM8350) is called “Lahaina” internally. Named after a city on the island of Maui, Hawaii.
— Roland Quandt (@rquandt) July 24, 2020
The flagship processor will be built on the 5nm process. Qualcomm will reportedly introduce a super-large core architectural combination, which is Cortex X1+Cortex A78. ARM details the Cortex X1 core architecture to provide a maximum performance that is 30% higher than that of Cortex-A77 and 23% higher than the maximum performance of the Cortex-A78 core released at the same time. The machine learning capability is said to be twice that of Cortex-A78.
Furthermore, Qualcomm will no longer utilise an external baseband design on the Snapdragon 875G but the baseband chip will be integrated with the processor with improvement in the performance.
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